| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 6 | |
| #2 | China | 5 | |
| #3 | WIPO (World Intellectual Property Organization) | 4 | |
| #4 | Taiwan | 2 | |
| #5 | EPO (European Patent Office) | 1 | |
| #6 | Hong Kong | 1 | |
| #7 | Japan | 1 | |
| #8 | Republic of Korea | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Surface technology and coating |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Electrolytic coating production | |
| #3 | Devices for applying fluent materials |
| # | Name | Total Patents |
|---|---|---|
| #1 | Keigler Arthur | 18 |
| #2 | Liu Zhenqiu | 9 |
| #3 | Wu Qunwei | 7 |
| #4 | Harrell John | 7 |
| #5 | Chiu Johannes | 6 |
| #6 | Goodman Daniel L | 4 |
| #7 | Arthur Keigler | 3 |
| #8 | Liu Zhenqui | 3 |
| #9 | Qunwei Wu | 2 |
| #10 | Guarnaccia David | 2 |
| Publication | Filing date | Title |
|---|---|---|
| US2011024964A1 | Substrate processing pallet with cooling | |
| JP2007046154A | Method and device for subjecting workpiece to fluid treatment | |
| US2006110536A1 | Balancing pressure to improve a fluid seal | |
| CN1920105A | Method and apparatus for fluid processing a workpiece | |
| US2005110291A1 | Ultra-thin wafer handling system |