NINGBO SEMICONDUCTOR INT CORPORATION SHANGHAI BRANCH has a total of 55 patent applications. Its first patent ever was published in 2018. It filed its patents most often in WIPO (World Intellectual Property Organization), Republic of Korea and United States. Its main competitors in its focus markets basic communication technologies, audio-visual technology and semiconductors are DAISHINKU CORP, MATSUSHIMA KOGYO KK and FUJITSU MEDIA DEVICE KK.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 46 | |
#2 | Republic of Korea | 8 | |
#3 | United States | 1 |
# | Industry | |
---|---|---|
#1 | Basic communication technologies | |
#2 | Audio-visual technology | |
#3 | Semiconductors | |
#4 | Micro-structure and nano-technology | |
#5 | Optics | |
#6 | Telecommunications | |
#7 | Machine tools | |
#8 | Computer technology |
# | Name | Total Patents |
---|---|---|
#1 | Qin Xiaoshan | 22 |
#2 | Liu Mengbin | 19 |
#3 | Luo Hailong | 13 |
#4 | Chen Da | 12 |
#5 | Qi Fei | 3 |
#6 | Xu Situo | 2 |
#7 | Di Yunxiang | 2 |
#8 | Sui Huan | 1 |
#9 | Yang Guohuang | 1 |
#10 | Li Wei | 1 |
Publication | Filing date | Title |
---|---|---|
US2020366267A1 | Air gap type semiconductor device package structure and fabrication method thereof | |
WO2021012396A1 | Packaging module and packaging method for baw resonator | |
KR20200035237A | Image sensor module and manufacturing method thereof | |
KR20200035236A | Image sensor module and manufacturing method thereof |