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HANGZHOU JIANWENLU TECH CO LTD

Overview
  • Total Patents
    28
  • GoodIP Patent Rank
    57,853
About

HANGZHOU JIANWENLU TECH CO LTD has a total of 28 patent applications. Its first patent ever was published in 2019. It filed its patents most often in China. Its main competitors in its focus markets basic communication technologies, semiconductors and micro-structure and nano-technology are HEYUAN CHOICORE PHOTOELECTRIC TECH CO LTD, ANHUI ANUKI TECH CO LTD and FUJI DENKA KK.

Patent filings in countries

World map showing HANGZHOU JIANWENLU TECH CO LTDs patent filings in countries
# Country Total Patents
#1 China 28

Patent filings per year

Chart showing HANGZHOU JIANWENLU TECH CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Sheng Jinghao 27
#2 Jiang Zhou 27
#3 Li Linping 23
#4 Zhang Weijun 1
#5 Ni Zhengchun 1
#6 Guo Haifeng 1
#7 Wei Deyi 1

Latest patents

Publication Filing date Title
CN111934644A Interdigital electrode structure, manufacturing method thereof and surface acoustic wave device with interdigital electrode structure
CN111892015A Wafer-level packaging method and packaging structure of MEMS device
CN111934639A Cavity structure of bulk acoustic wave resonator and manufacturing process
CN111900949A Film bulk acoustic resonator and manufacturing process thereof
CN111817679A Film bulk acoustic resonator and manufacturing process thereof
CN111669141A Electrode structure of bulk acoustic wave resonator and manufacturing process
CN111756346A Connecting structure of solid assembled resonator and manufacturing process
CN111697942A Cavity processing technology for MEMS device, bulk acoustic wave resonator and manufacturing technology thereof
CN111510099A Film bulk acoustic wave filter and wafer level packaging method thereof
CN111262542A Bulk acoustic wave resonator with heat dissipation structure and manufacturing process
CN111342792A Solid assembled resonator with electromagnetic shielding structure and manufacturing process
CN111294010A Cavity structure of film bulk acoustic resonator and manufacturing process
CN111245387A Structure and manufacturing process of solid assembled resonator
CN111211757A Top electrode structure of bulk acoustic wave resonator and manufacturing process
CN111162746A Flat piezoelectric layer structure of bulk acoustic wave resonator and manufacturing process
CN111200414A Bottom electrode structure of bulk acoustic wave resonator and process method
CN110767606A Electronic component with composite function and manufacturing method thereof
CN111092604A Cavity structure of bulk acoustic wave resonator and manufacturing method
CN110681325A Method for manufacturing composite microspheres and core-shell type composite microspheres for EMI shielding
CN110752189A EMI shielding material, EMI shielding process and communication module product