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NEXPLANAR CORP

Overview
  • Total Patents
    146
  • GoodIP Patent Rank
    30,496
  • Filing trend
    ⇩ 100.0%
About

NEXPLANAR CORP has a total of 146 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2004. It filed its patents most often in Republic of Korea, Taiwan and China. Its main competitors in its focus markets machine tools, semiconductors and machines are ALLISON WILLIAM C, IV TECHNOLOGIES CO LTD and SHENGZHOU HUANDING GLASS TECHNOLOGY CO LTD.

Patent filings per year

Chart showing NEXPLANAR CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Scott Diane 118
#2 Allison William C 100
#3 Huang Ping 76
#4 Lefevre Paul Andre 51
#5 Simpson Alexander William 47
#6 Kerprich Robert 43
#7 Frentzel Richard 38
#8 Lacasse James P 29
#9 Charns Leslie M 19
#10 Misra Sudhanshu 16

Latest patents

Publication Filing date Title
WO2015195488A1 Polishing pad having porogens with liquid filler
US2015266160A1 Polishing pad with grooved foundation layer and polishing surface layer
US2016221145A1 Low density polishing pad
US2015065020A1 Customized polishing pads for CMP and methods of fabrication and use thereof
US2015038066A1 Low density polishing pad
CN104520068A Polishing pad with polishing surface layer having aperture or opening above transparent foundation layer
US2014273777A1 Polishing pad having polishing surface with continuous protrusions having tapered sidewalls
US2014206268A1 Polishing pad having polishing surface with continuous protrusions
CN104105575A Polishing pad with foundation layer and polishing surface layer
WO2012151076A1 Polishing pad with alignment feature
CN103260828A Polishing pad for eddy current end-oint detection
CN103097080A Soft polishing pad for polishing a semiconductor substrate
CN102770239A CMP pad with local area transparency
US2009318063A1 Polishing systems
KR20130092625A Customized polishing pads for cmp and methods of fabrication and use thereof
TW200639019A Customized polishing pads for cmp and methods of fabrication and use thereof
US2006276109A1 Customized polishing pads for CMP and methods of fabrication and use thereof