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IV TECHNOLOGIES CO LTD

Overview
  • Total Patents
    74
  • GoodIP Patent Rank
    86,216
  • Filing trend
    ⇩ 80.0%
About

IV TECHNOLOGIES CO LTD has a total of 74 patent applications. It decreased the IP activity by 80.0%. Its first patent ever was published in 2002. It filed its patents most often in Taiwan, United States and China. Its main competitors in its focus markets machine tools, machines and surface technology and coating are SAKAMOTO HIROAKI, YANCHENG XUHUA SHOES MACHINERY CO LTD and RUD STARCKE GMBH & CO KG.

Patent filings in countries

World map showing IV TECHNOLOGIES CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 52
#2 United States 15
#3 China 5
#4 Republic of Korea 1
#5 Singapore 1

Patent filings per year

Chart showing IV TECHNOLOGIES CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Shih Wen-Chang 25
#2 Chang Yung-Chung 18
#3 Chu Min-Kuei 16
#4 Wang Yu-Piao 11
#5 Pai Kun-Che 9
#6 Wang Yu Piao 9
#7 Wang Chao-Chin 6
#8 Wei Lung-Chen 5
#9 Pan Yu-Hao 4
#10 Wang Chao Chin 4

Latest patents

Publication Filing date Title
TW202045304A Polishing pad, manufacturing method of polishing pad and polishing method
TW202035067A Polishing pad, manufacturing method of polishing pad and polishing method
TWI674947B Polishing pad, manufacturing method of polishing pad and polishing method
TWI642516B Polishing pad and polishing method
TWI650202B Polishing pad, manufacturing method of a polishing pad and polishing method
TWI647065B Polishing pad and method of forming the same and polishing method
TW201837154A Polishing pad and polishing method
TWI626117B Polishing pad and polishing method
TWI601598B Polishing pad and polishing method
TW201802151A Polishing layer and method of forming the same and polishing method
TWI593511B Polishing pad and polishing method
TW201742884A Base layer, polishing pad with base layer and polishing method
TW201741073A Base layer, polishing pad with base layer and polishing method
TW201729948A Polishing pad, manufacturing method of a polishing pad and polishing method
TW201728413A Cap layer, polishing pad with cap layer, method for avoiding polishing pad deformation and polishing method
TWI549781B Polishing pad, polishing system and polishing method
TWI549778B Suction pad for polishing apparatus and polishing system
TW201617172A Polishing pad set, polishing system and polishing method
TW201627102A Polishing pad
TW201429619A Cutting apparatus, manufacturing method of polishing pad