NEOPAD TECHNOLOGIES CORP has a total of 16 patent applications. Its first patent ever was published in 2004. It filed its patents most often in WIPO (World Intellectual Property Organization), Canada and China. Its main competitors in its focus markets machine tools and machines are IV TECH CO LTD, UNIVIS INC and IV TECHNOLOGIES CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 4 | |
#2 | Canada | 2 | |
#3 | China | 2 | |
#4 | Republic of Korea | 2 | |
#5 | Singapore | 2 | |
#6 | Australia | 1 | |
#7 | Mexico | 1 | |
#8 | Taiwan | 1 | |
#9 | United States | 1 |
# | Industry | |
---|---|---|
#1 | Machine tools | |
#2 | Machines |
# | Technology | |
---|---|---|
#1 | Grinding or polishing devices | |
#2 | Grinding tools | |
#3 | Additive manufacturing | |
#4 | Fillers | |
#5 | Shaping of plastics |
# | Name | Total Patents |
---|---|---|
#1 | Roy Pradip K | 16 |
#2 | Misra Sudhanshu | 11 |
#3 | Deopura Manish | 10 |
#4 | Vaidya Hem M | 3 |
#5 | Manish Deopura | 1 |
#6 | Sudhanshu Misra | 1 |
Publication | Filing date | Title |
---|---|---|
KR20070108546A | Customized polishing pads for cmp and methods of fabrication and use thereof | |
CA2598272A1 | Customized polishing pads for cmp and methods of fabrication and use thereof | |
WO2006089291A1 | Use of phosphorescent materials for two-dimensional wafer mapping in a chemical mechanical polishing | |
CN101166604A | Customized polishing pads for CMP and methods of fabrication and use thereof | |
US2006019587A1 | Methods for producing in-situ grooves in chemical mechanical planarization (CMP) pads, and novel CMP pad designs | |
KR20060017824A | Synthesis of a functionally graded pad for chemical mechanical planarization | |
CA2519942A1 | Chip customized polish pads for chemical mechanical planarization (cmp) |