Learn more

MICRONAS SEMICONDUCTOR HOLDING

Overview
  • Total Patents
    24
About

MICRONAS SEMICONDUCTOR HOLDING has a total of 24 patent applications. Its first patent ever was published in 1997. It filed its patents most often in Germany, EPO (European Patent Office) and United States. Its main competitors in its focus markets semiconductors, digital networks and basic communication technologies are CIMSA SINTRA, AVAGO TECH GENERAL IP and OKAZAKI KENICHI.

Patent filings in countries

World map showing MICRONAS SEMICONDUCTOR HOLDINGs patent filings in countries
# Country Total Patents
#1 Germany 11
#2 EPO (European Patent Office) 11
#3 United States 2

Patent filings per year

Chart showing MICRONAS SEMICONDUCTOR HOLDINGs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Igel Guenter 7
#2 Mall Martin 3
#3 Menkhoff Andreas Dr 3
#4 Menkhoff Andreas 2
#5 Winterer Martin Dipl-Phys 2
#6 Temerinac Miodrag Prof-Dr-Ing 1
#7 Scherrer Remy Dipl-Ing 1
#8 Giebel Burkhard 1
#9 Theus U Dr 1
#10 Witte Fran-Otto 1

Latest patents

Publication Filing date Title
DE19736754A1 Integrated gas discharge component for surge protection
EP0896481A1 Adaptive filter
DE19733829A1 Method for encrypting or decrypting a data sequence
EP0895386A1 Carrier control circuit for a receiver of digital transmitted signals
DE19729785A1 Capacitor arrangement and its manufacturing process
EP0889586A1 Device for reducing data rate
EP0889588A1 Filter combination for sample rate conversion
EP0889587A1 Device for reducing data rate
DE19724595A1 Structured metal layer production especially on MOS structure
DE19720766A1 Digital amplitude demodulator
DE19717791A1 Test transistor and manufacturing method
DE19717792A1 Method for producing a capacitance structure on a silicon substrate in a MOS process
EP0873041A1 Digital sound processor
DE19716480A1 Method for producing a device with a cavity for receiving an optical waveguide
DE19710375A1 Process for the production of spatially structured components
DE19707887A1 Process for producing and separating electronic elements with conductive contact connections
DE19707886A1 Method for producing contact holes in a semiconductor device