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ACORN TECH INC

Overview
  • Total Patents
    178
  • GoodIP Patent Rank
    31,777
  • Filing trend
    ⇩ 10.0%
About

ACORN TECH INC has a total of 178 patent applications. It decreased the IP activity by 10.0%. Its first patent ever was published in 1994. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets semiconductors, digital networks and telecommunications are XITONG SCI TECH CO LTD, KHAN ASIF and SU YI.

Patent filings per year

Chart showing ACORN TECH INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Clifton Paul A 63
#2 Grupp Daniel E 50
#3 Gaines R Stockton 43
#4 Connelly Daniel J 39
#5 Goebel Andreas 36
#6 Lopez De Victoria Fernando 26
#7 Despain Alvin M 22
#8 Thompson Steven C 22
#9 Harrison Walter A 15
#10 Connely Daniel J 9

Latest patents

Publication Filing date Title
US2020273991A1 SOI wafers and devices with buried stressor
US2018212056A1 Strained semiconductor-on-insulator by deformation of buried insulator induced by buried stressor
CN110088911A Nano-wire transistor with the source electrode and drain electrode inducted by the electrical contact for having negative schottky barrier height
US2018145184A1 Nanowire transistor with source and drain induced by electrical contacts with negative schottky barrier height
US2017323973A1 Soi wafers and devices with buried stressor
US2016308057A1 Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer
US9620611B1 MIS contact structure with metal oxide conductor
US2017034027A1 Communication system determining time of arrival using matching pursuit
US2015333933A1 Least squares channel identification for OFDM Systems
CN105075206A Non-linear time domain channel estimation in ofdm systems
WO2014143573A1 Block time domain channel estimation in ofdm system
WO2014149570A1 Communication system and method using subspace interference cancellation
TW202029442A Improving metal contacts to group iv semiconductors by inserting interfacial atomic monolayers
TW201444046A Improving metal contacts to group IV semiconductors by inserting interfacial atomic monolayers
WO2013115983A1 Method and system for activation of performance enhancements for mobile devices
WO2013077954A1 Improving metal contacts to group iv semiconductors by inserting interfacial atomic monolayers
TW201338471A Ofdm receiver with time domain channel estimation
DE102012015309A1 Tensile semiconductor photon emission and detection arrays and integrated photonic systems
WO2012027551A1 Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer
US2011269281A1 Transistor with longitudinal strain in channel induced by buried stressor relaxed by implantation