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MICROELECTRONICS & COMPUTER

Overview
  • Total Patents
    293
About

MICROELECTRONICS & COMPUTER has a total of 293 patent applications. Its first patent ever was published in 1986. It filed its patents most often in United States, United Kingdom and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, audio-visual technology and machines are GE EMBEDDED ELECTRONICS OY, SUMITOMO KINZOKU CERAMICS KK and EASTERN KK.

Patent filings per year

Chart showing MICROELECTRONICS & COMPUTERs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kumar Nalin 57
#2 Xie Chenggang 34
#3 Nelson Richard D 22
#4 Mackay Colin A 20
#5 Carey David H 18
#6 Herrell Dennis J 17
#7 Gupta Omkarnath R 12
#8 Lin Charles W C 10
#9 Andrews Daniel M 10
#10 Olla Michael A 9

Latest patents

Publication Filing date Title
US5659224A Cold cathode display device
US5675216A Amorphic diamond film flat field emission cathode
US5548185A Triode structure flat panel display employing flat field emission cathode
US5679043A Method of making a field emitter
US5628659A Method of making a field emission electron source with random micro-tip structures
US5656941A Tab tape-based bare chip test and burn-in carrier
US5574814A Parallel optical transceiver link
CA2172803A1 Methods for fabricating flat panel display systems and components
US5531880A Method for producing thin, uniform powder phosphor for display screens
US5503948A Thin cell electrochemical battery system; and method of interconnecting multiple thin cells
AU7512994A Lateral field emitter device and method of manufacturing same
US5536193A Method of making wide band gap field emitter
US5543684A Flat panel display based on diamond thin films
US5379191A Compact adapter package providing peripheral to area translation for an integrated circuit chip
US5434530A Superconducting semiconducting cross-bar circuit
US5399238A Method of making field emission tips using physical vapor deposition of random nuclei as etch mask
US5544018A Electrical interconnect device with customizeable surface layer and interwoven signal lines
US5509071A Electronic proof of receipt
US5508228A Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same
WO9428571A1 Amorphic diamond film flat field emission cathode