Learn more

MACDERMID ENTHONE INC

Overview
  • Total Patents
    122
  • GoodIP Patent Rank
    14,469
  • Filing trend
    ⇩ 34.0%
About

MACDERMID ENTHONE INC has a total of 122 patent applications. It decreased the IP activity by 34.0%. Its first patent ever was published in 2004. It filed its patents most often in EPO (European Patent Office), United States and Republic of Korea. Its main competitors in its focus markets surface technology and coating, semiconductors and audio-visual technology are AVENI, ELECTROPLATING ENG and MELTEX INC.

Patent filings per year

Chart showing MACDERMID ENTHONE INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Whitten Kyle 36
#2 Commander John 27
#3 Paneccasio Vincent 18
#4 Hurtubise Richard 16
#5 Rouya Eric 14
#6 Richardson Thomas 14
#7 Paneccasio Jr Vincent 13
#8 Richardson Thomas B 13
#9 Abys Joseph A 11
#10 Sun Shaopeng 10

Latest patents

Publication Filing date Title
TW202030374A Composition and method for fabrication of nickel interconnects
US2020165739A1 Selective Plating of Three Dimensional Surfaces to Produce Decorative and Functional Effects
US10443135B1 Near neutral pH pickle on multi-metals
US2019350089A1 Carbon-based direct plating process
US2019112713A1 Compressively Stressed Medium Phosphorus Electroless Nickel
US2019091724A1 Textured hardcoat films
CN109952390A The electro-deposition of copper in microelectronics part
EP3504186A1 Copper deposition in wafer level packaging of integrated circuits
WO2018057490A1 Copper plating method and composition for semiconductor substrates
US2019010624A1 Cobalt Filling of Interconnects
US2018355502A1 Process for metalization of copper pillars in the manufacture of microelectronics
US2018347038A1 Elimination of H2S in immersion tin plating solution
US2017233883A1 Leveler compositions for use in copper deposition in manufacture of microelectronics
CA2999295A1 Flexible color adjustment for dark cr(iii) platings
KR20180022700A Cobalt Filling of Interconnections in Microelectronics
EP3255175A1 Use of water soluble lanthanide compounds as stabilizer in electrolytes for electroless metal deposition
EP3156517A1 Use of water soluble and air stable phosphaadamantanes as stabilizer in electrolytes for electroless metal deposition
TW201623696A Levelers for copper deposition in microelectronics
EP3059277A1 Inhibitor composition for racks when using chrome free etches in a plating on plastics process
EP2845928A1 Aqueous electrolyte composition having a reduced airborne emission