LIQUID WIRE INC has a total of 11 patent applications. Its first patent ever was published in 2018. It filed its patents most often in United States and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets measurement, telecommunications and electrical machinery and energy are INPAQ TECH LTD, LEIBA YIGAL and SAKUMA MASAO.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 7 | |
#2 | WIPO (World Intellectual Property Organization) | 4 |
# | Industry | |
---|---|---|
#1 | Measurement | |
#2 | Telecommunications | |
#3 | Electrical machinery and energy | |
#4 | Semiconductors | |
#5 | Materials and metallurgy | |
#6 | Audio-visual technology |
# | Technology | |
---|---|---|
#1 | Measuring force, work and fluid pressure | |
#2 | Semiconductor devices | |
#3 | Cables and insulators | |
#4 | Antennas | |
#5 | Alloys | |
#6 | Casings and printed circuits | |
#7 | Waveguides |
# | Name | Total Patents |
---|---|---|
#1 | Ronay Mark | 11 |
#2 | Kinzel Charles | 4 |
#3 | Rivera Trevor Spiegel Antonio | 3 |
#4 | Godshalk Edward | 3 |
#5 | Hopkins Michael Adventure | 3 |
#6 | Carbo Jorge E | 3 |
#7 | Carbo Jorge | 1 |
#8 | Hopkins Michael | 1 |
#9 | Rivera Trevor | 1 |
#10 | Desabathina Sai Srinivas | 1 |
Publication | Filing date | Title |
---|---|---|
WO2020247697A1 | Deformable sensors with selective restraint | |
US2020381349A1 | Continuous Interconnects Between Heterogeneous Materials | |
WO2020227452A1 | Deformable conductive structures and methods for fabrication | |
US2020066628A1 | Structures With Deformable Conductors | |
US2019056277A1 | Sensors with Deformable Conductors and Selective Deformation | |
US2018247727A1 | Deformable conductors and related sensors, antennas and multiplexed systems |