Learn more

LEYBOLD MATERIALS GMBH

Overview
  • Total Patents
    60
About

LEYBOLD MATERIALS GMBH has a total of 60 patent applications. Its first patent ever was published in 1992. It filed its patents most often in Germany, EPO (European Patent Office) and Japan. Its main competitors in its focus markets surface technology and coating, materials and metallurgy and electrical machinery and energy are MATERION ADVANCED MAT GERMANY GMBH, HARDIDE PLC and CVD INC.

Patent filings in countries

World map showing LEYBOLD MATERIALS GMBHs patent filings in countries

Patent filings per year

Chart showing LEYBOLD MATERIALS GMBHs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kutzner Martin 19
#2 Schlott Martin Dr 19
#3 Dauth Wolfgang 15
#4 Weigert Martin Dr 12
#5 Schlott Martin 12
#6 Wollenberg Norbert 10
#7 Gehman Bruce 9
#8 Heindel Josef 9
#9 Konietzka Uwe 7
#10 Gehman Bruce Dr 6

Latest patents

Publication Filing date Title
DE19925330A1 Sputter target, used for thin film cathodic sputter deposition, is produced or regenerated by passing an IR source over target material to effect melting on a cast plate or worn target region
DE19920304A1 Target used for sputtering cathodes of vacuum deposition devices has protrusions extending into the target material
DE19810246A1 Sputtering target for the deposition of nitridic or oxidic silicon layers and process for its production
DE19806879A1 Production of a target for the sputter cathode of a vacuum coating installation
DE19805471A1 Method for repairing target base plates
DE19802482A1 Sputter cathode target casting apparatus has a two-layer base plate
DE19735469A1 Target for a sputter cathode
DE19715806A1 Process for the production of a sputtering target based on zinc sulfide and the sputtering target itself
DE19710903A1 Sputtering target for optical storage layer deposition
EP0787819A1 Tin or tin base alloy sputtering target
DE19648390A1 Target for the sputter cathode of a vacuum coating plant
EP0787818A1 Tin or tin base alloy sputtering target
DE19627533A1 Target for the sputter cathode of a vacuum coating installation
DE19611433A1 Sputter target production method
DE19602389A1 Sputter target manufacturing method for surface coating installations
DE19538365A1 High purity tin@ alloy target material for sputter coating process
DE19535894A1 Target for the sputter cathode of a vacuum coating system and process for its production
DE19521477A1 Boron nitride deposition target or evapn. source material
DE19508898A1 Prodn. of indium oxide-tin oxide target for cathode sputtering
DE19508535A1 Magnetron cathodic sputtering target