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LAMINA CERAMICS INC

Overview
  • Total Patents
    57
About

LAMINA CERAMICS INC has a total of 57 patent applications. Its first patent ever was published in 1998. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, electrical machinery and energy and machines are ORYX TECHN CORP, METTLER ROLLIN W JUN and HESTIA TECHNOLOGIES INC.

Patent filings per year

Chart showing LAMINA CERAMICS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Mazzochette Joseph 36
#2 Thaler Barry Jay 10
#3 Tormey Ellen Schwartz 10
#4 Blonder Greg 9
#5 Blonder Greg E 8
#6 Mazzochette Joseph B 7
#7 Amaya Edmar 6
#8 Prabhu Ashok Narayan 5
#9 Liberatore Michael James 4
#10 Geller Bernard Dov 3

Latest patents

Publication Filing date Title
TW200704283A Solid state LED bridge rectifier light engine
WO2007005003A1 Light emitting diode package assembly that emulates the light pattern produced by an incandescent filament bulb
KR20070013294A Light emitting diode arrays with improved light extraction
US2006012986A1 LED array package with internal feedback and control
US2004124002A1 Method and structures for enhanced temperature control of high power components on multilayer LTCC and LTCC-M boards
WO2004045016A2 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards
US2005040908A1 Low temperature co-fired ceramic-metal circulators and isolators
US2004222433A1 Light emitting diodes packaged for high temperature operation
EP1470742A2 Monolithic disc delay line and method for making same
US2003062185A1 Method of making ceramic multilayer circuit boards mounted in a patterned metal support substrate
US6759940B2 Temperature compensating device with integral sheet thermistors
US6720859B2 Temperature compensating device with embedded columnar thermistors
US7026891B2 Monolithic disc delay line
US6455930B1 Integrated heat sinking packages using low temperature co-fired ceramic metal circuit board technology
US6709749B1 Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate