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KOSTEK SYSTEMS INC

Overview
  • Total Patents
    34
  • GoodIP Patent Rank
    87,772
  • Filing trend
    ⇩ 20.0%
About

KOSTEK SYSTEMS INC has a total of 34 patent applications. It decreased the IP activity by 20.0%. Its first patent ever was published in 2001. It filed its patents most often in Republic of Korea, Taiwan and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets semiconductors, surface technology and coating and packaging and shipping are GENESEM INC, WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO LTD and CHONGQING KANGJIA OPTOELECTRONIC TECH RESEARCH INSTITUTE CO LTD.

Patent filings in countries

World map showing KOSTEK SYSTEMS INCs patent filings in countries

Patent filings per year

Chart showing KOSTEK SYSTEMS INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Bae Jun Ho 28
#2 Kim Yong Sub 17
#3 Heo Sung Moo 6
#4 Lee Seung Hyun 6
#5 Lee Ji Hoon 5
#6 Ji Young Ho 4
#7 Lee Yonh Hoon 4
#8 Shin Jae Hyouk 3
#9 Yeo Won Jae 3
#10 Do Sun Dong 2

Latest patents

Publication Filing date Title
KR20200095744A Equipment front end mocule of wafer transferring apparatus
KR20200093222A Transferring apparatus of wafer
KR20200063007A Lamination apparatus of temporary bonding film and method thereof
KR20200063006A Wafer bonding apparatus
KR20190123034A Transferring apparatus of wafer
KR20190123035A Transferring apparatus of wafer
KR20190063342A Vacuum maintaenance parts protecting apparatus of temporary bonding system
KR20190063341A Apparatus for peeling of temporary bonding film and thereof method
KR20190047449A Vision apparatus for aligning of temporary bonding system and thereof method
KR20180113058A Transferring apparatus of wafer
KR20180113057A Transferring apparatus of wafer
KR20180035476A APPARATUS of temporary bonding and THEREOF method
KR20180021547A APPARATUS of temporary bonding by using temporary bonding film and THEREOF method
KR20170044370A method of temporary bonding by using temporary bonding film
KR20170034674A Temporary bonded wafer debonding apparatus and thereof method
KR101642919B1 Transferring apparatus of wafer and transferring method of the same
KR20160064789A Wafer bonding apparatus and bonding method
KR20140128918A A Sorting apparatus for bonding a substrate
KR20150120118A Flat induction coil and plasma generating apparatus
TW201501220A A method for bonding/de-bonding of device wafer and carrier wafer and apparatus for bonding/de-bonding