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KAWAKATSU ICHIRO

Overview
  • Total Patents
    25
About

KAWAKATSU ICHIRO has a total of 25 patent applications. Its first patent ever was published in 1967. It filed its patents most often in Japan, EPO (European Patent Office) and Canada. Its main competitors in its focus markets materials and metallurgy and machine tools are WUXI RIYUE ALLOY MAT CO LTD, DANYANG HUALONG SUPERIOR STEEL CO LTD and NIPPON STEEL WELDING & ENG COLTD.

Patent filings in countries

World map showing KAWAKATSU ICHIROs patent filings in countries

Patent filings per year

Chart showing KAWAKATSU ICHIROs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Kawakatsu Ichiro 24
#2 Ichiro Kawakatsu 1

Latest patents

Publication Filing date Title
JP2004115906A METHOD FOR COATING Al-Si ALLOY ON SUBSTRATE OF Ti OR Ti ALLOY
JP2003306780A SURFACE HARDENING TREATMENT METHOD FOR Al OR Al ALLOY
JP2001254163A METHOD OF COATING Ni OR Ni ALLOY SUBSTRATE WITH Al OR Al ALLOY
JP2001225188A Solder alloy
JPH11254127A Method for brazing copper and aluminum
JPH10306384A Method for coating copper or copper alloy with al or al alloy
JPH10251862A Method for coating al or al alloy to metallic base body
JPH10156529A Method for soldering
JPH08267229A Brazing method of aluminum
JPH0878836A Device of measuring oxygen concentration of inert gas atmosphere soldering method
JPH07336037A Gas injection nozzle to be used for atmospheric soldering
JPH06304744A Method and device for soldering in inert atmosphere
JPH06269984A Low melting solder alloy
JPH03161191A Method for joining metal
JPH02101132A Low melting point solder
JPS63125636A Heat-resisting aluminum alloy
JPS63109137A Alloy for fin material having heat resistance
JPS6383251A Manufacture of high strength and high elasticity aluminum alloy
US4496098A Process for producing a tin/lead alloy solder joint with less wetting agent residue
GB1215817A Hard aluminium alloy