KANG DO WON has a total of 12 patent applications. It increased the IP activity by 100.0%. Its first patent ever was published in 1987. It filed its patents most often in Republic of Korea, United States and China. Its main competitors in its focus markets chemical engineering, electrical machinery and energy and control are NANOGEN INC, ROBBINS SCIENT CORP and ORCHID BIOSCIENCES INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | Republic of Korea | 7 | |
#2 | United States | 3 | |
#3 | China | 1 | |
#4 | EPO (European Patent Office) | 1 |
# | Industry | |
---|---|---|
#1 | Chemical engineering | |
#2 | Electrical machinery and energy | |
#3 | Control | |
#4 | Semiconductors | |
#5 | Computer technology | |
#6 | Measurement | |
#7 | Consumer goods |
# | Name | Total Patents |
---|---|---|
#1 | Kang Do Won | 8 |
#2 | Kang Do-Won | 3 |
#3 | Lee Jin | 1 |
#4 | Oh Chang Rok | 1 |
#5 | Nam Jae Gyu | 1 |
#6 | Mun Jeong Tak | 1 |
#7 | Lee Jin Hyeong | 1 |
#8 | Mun Byeong Cheol | 1 |
Publication | Filing date | Title |
---|---|---|
US2018257067A1 | Automated experiment apparatus and automated experiment method using the same | |
KR20140135893A | Test device with observation function to sample | |
US2013280147A1 | Airtight container for experiments | |
KR20120042352A | Airtight container for laboratory | |
KR20120008252A | A apparatus for washing vessel for laboratory | |
KR20110089990A | A stand for condenser | |
KR100442184B1 | Method and apparatus for manufacturing solder balls for bga(ball grid array) frequently used in electronic packaging | |
KR100231933B1 | Gold alloy for bonding wire of semiconductor device | |
KR900000990B1 | Method manufacture wire for semiconductor device |