A method of thermally contacting opposing electrical terminals of a semiconductor device array
DE102009010232A1
Multimode optical fiber, process for its preparation and diode laser module with such a multimode optical fiber
WO2009049799A1
Laser diode bars electrically series-connected on a metal cooling body
DE102008049084A1
Heat dissipating module has two sides lying opposite each other, where semiconductor element is provided, and heat dissipating body is provided with one contact surface which is adjacent to another contact surface
DE102008036439A1
Heat dissipation module with a semiconductor element and manufacturing method for such a heat dissipation module
DE102008035829A1
Light power detecting device for laser beam in laser module, has adjusting device for continuous cross sectional variation of light path between two dispersive regions for adjusting light power
DE102008026856A1
Cooling element for an electronic component and device with an electronic component
DE102008011525A1
Method for producing a light transmission arrangement and light transmission arrangement
DE102007051798B3
Micro-channel heat sink for cooling semiconductor laser component, has electrically isolating inorganic protective layer or closing protective layer formed from metal and applied on sealing surfaces and inner surfaces of inlet and outlet
DE102007051797B3
Corrosion resistant microchannel heat sink
DE102007051796A1
Cooling device for semiconductor devices
DE102007051800A1
Carrier body for semiconductor devices
DE102007035919B3
Sensor system for line breakage proof object detection
DE102007016772A1
Stackable multilayer microchannel heat sink
EP1811617A1
Base for a vertical arrangement of laserdiode bars with a stop
Optical device for high power diode laser uses homogenizing element with pairs of total internal reflection side faces between light input end face and light output end face
