| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Japan | 14 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Computer technology | |
| #3 | Audio-visual technology | |
| #4 | Basic communication technologies | |
| #5 | Measurement |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Static stores | |
| #3 | Code conversion | |
| #4 | Measuring electric variables | |
| #5 | Electric digital data processing | |
| #6 | Television |
| # | Name | Total Patents |
|---|---|---|
| #1 | Belgacem Haba | 4 |
| #2 | Ishihara Masamichi | 3 |
| #3 | Endo Kimiyoshi | 3 |
| #4 | Ueda Hirotaka | 2 |
| #5 | Jones Jr Oscar Frederick | 2 |
| #6 | Giles Humpston | 2 |
| #7 | Parris Michael C | 2 |
| #8 | Richard Dewitt Crisp | 1 |
| #9 | Kenneth Allen Honer | 1 |
| #10 | Moti Margalit | 1 |
| Publication | Filing date | Title |
|---|---|---|
| JP2014143448A | Electronic component for wiring and manufacturing method of the same | |
| JP2014090219A | Semiconductor device package structure and manufacturing method thereof | |
| JP2014090216A | Bump structure and method of manufacturing the same | |
| JP2013141042A | Bump structure and method of manufacturing the same |