US6617241B1
|
|
Method of thick film planarization
|
US6696857B1
|
|
High speed CMOS dual modulus prescaler using pull down transistor
|
US2004119626A1
|
|
Resistor string digital to analog converter with differential outputs and reduced switch count
|
SG104348A1
|
|
Apparatus and method for fluid-based cooling of heat-generating devices
|
US6727768B1
|
|
Relaxation CCO for PLL-based constant tuning of GM-C filters
|
US6667189B1
|
|
High performance silicon condenser microphone with perforated single crystal silicon backplate
|
US2004002323A1
|
|
Fully integrated self-tuned image rejection downconversion system
|
SG118138A1
|
|
A heat transfer apparatus
|
US2003219683A1
|
|
Low temperature resist trimming process
|
US2003218227A1
|
|
Method of fabricating micro-mirror switching device
|
US6716661B2
|
|
Process to fabricate an integrated micro-fluidic system on a single wafer
|
US2003216026A1
|
|
Method of forming dual damascene pattern using dual bottom anti-reflective coatings (BARC)
|
US2003207029A1
|
|
Method to minimize iso-dense contact or via gap filling variation of polymeric materials in the spin coat process
|
US2003205556A1
|
|
Capillary with glass internal surface
|
SG104323A1
|
|
Miniaturized thermal cycler
|
SG101536A1
|
|
A high frequency board-to-board connector
|
US2003160022A1
|
|
Apparatus and process for bulk wet etch with leakage protection
|
SG93927A1
|
|
Process of forming metal surfaces compatible with a wire bonding and semiconductor integrated circuits manufactured by the process
|
US6583667B1
|
|
High frequency CMOS differential amplifiers with fully compensated linear-in-dB variable gain characteristic
|
US6437612B1
|
|
Inductor-less RF/IF CMOS buffer for 50Ω off-chip load driving
|