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INST OF MICROELECTRONICS

Overview
  • Total Patents
    176
About

INST OF MICROELECTRONICS has a total of 176 patent applications. Its first patent ever was published in 1995. It filed its patents most often in United States, Singapore and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, micro-structure and nano-technology and basic communication technologies are HITACHI TOBU SEMICONDUCTOR LTD, TAKAGI KAZUTAKA and XEMOD INC.

Patent filings per year

Chart showing INST OF MICROELECTRONICSs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Sridhar Uppili 17
#2 Foo Pang Dow 15
#3 Lim Thiam Beng 12
#4 Nagarajan Ranganathan 11
#5 Chen Yu 10
#6 Uppili Sridhar 10
#7 Zou Quanbo 10
#8 Wang Zhe 8
#9 Ranganathan Nagarajan 8
#10 Dasgupta Uday 7

Latest patents

Publication Filing date Title
US6617241B1 Method of thick film planarization
US6696857B1 High speed CMOS dual modulus prescaler using pull down transistor
US2004119626A1 Resistor string digital to analog converter with differential outputs and reduced switch count
SG104348A1 Apparatus and method for fluid-based cooling of heat-generating devices
US6727768B1 Relaxation CCO for PLL-based constant tuning of GM-C filters
US6667189B1 High performance silicon condenser microphone with perforated single crystal silicon backplate
US2004002323A1 Fully integrated self-tuned image rejection downconversion system
SG118138A1 A heat transfer apparatus
US2003219683A1 Low temperature resist trimming process
US2003218227A1 Method of fabricating micro-mirror switching device
US6716661B2 Process to fabricate an integrated micro-fluidic system on a single wafer
US2003216026A1 Method of forming dual damascene pattern using dual bottom anti-reflective coatings (BARC)
US2003207029A1 Method to minimize iso-dense contact or via gap filling variation of polymeric materials in the spin coat process
US2003205556A1 Capillary with glass internal surface
SG104323A1 Miniaturized thermal cycler
SG101536A1 A high frequency board-to-board connector
US2003160022A1 Apparatus and process for bulk wet etch with leakage protection
SG93927A1 Process of forming metal surfaces compatible with a wire bonding and semiconductor integrated circuits manufactured by the process
US6583667B1 High frequency CMOS differential amplifiers with fully compensated linear-in-dB variable gain characteristic
US6437612B1 Inductor-less RF/IF CMOS buffer for 50Ω off-chip load driving