| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Israel | 5 | |
| #2 | Australia | 2 | |
| #3 | WIPO (World Intellectual Property Organization) | 2 | |
| #4 | Japan | 1 | |
| #5 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Computer technology | |
| #2 | Semiconductors | |
| #3 | Measurement | |
| #4 | Optics |
| # | Technology | |
|---|---|---|
| #1 | Image data processing | |
| #2 | Semiconductor devices | |
| #3 | Measuring length, angles and areas | |
| #4 | Optical systems | |
| #5 | Analysing materials |
| # | Name | Total Patents |
|---|---|---|
| #1 | Levi Yakov | 4 |
| #2 | Zaslavski Alexander | 4 |
| #3 | Gefen Michael | 4 |
| #4 | Ben-Har Abraham | 2 |
| #5 | Geffen Michael | 2 |
| #6 | Michael Gefen | 1 |
| #7 | Abraham Benher | 1 |
| Publication | Filing date | Title |
|---|---|---|
| IL142753D0 | Conoscopic wafer-inspection system | |
| IL134383D0 | Color illumination microscope | |
| IL134008D0 | A method and system for measuring bump height | |
| IL120656D0 | Apparatus for analyzing cuts |