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INNOX CORP

Overview
  • Total Patents
    66
  • GoodIP Patent Rank
    40,356
  • Filing trend
    ⇩ 100.0%
About

INNOX CORP has a total of 66 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2003. It filed its patents most often in Republic of Korea, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets basic materials chemistry, semiconductors and surface technology and coating are LINTEC CORP, INNOX ADVANCED MAT CO LTD and MITSUI KAGAKU TOHCELLO KK ALSO KNOWN AS MITSUI CHEMICALS TOHCELLO INC.

Patent filings in countries

World map showing INNOX CORPs patent filings in countries

Patent filings per year

Chart showing INNOX CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kim Kwang Moo 29
#2 Lee Hwi Yong 15
#3 Park Young Don 13
#4 Chang Kyeong Ho 10
#5 Kweon Jeong Min 9
#6 Hong Ki Ha 9
#7 Shin Ki Cheol 9
#8 Park Soon Chun 9
#9 Kim Joon Ho 9
#10 Park Jeong Min 8

Latest patents

Publication Filing date Title
KR20180094558A Method and apparatus for manufacturing curved display protecting three dimensional sheet
KR20170020700A Composite multi-layer sheet with EMI shield and heat radiation and Manufacturing method thereof
KR101727159B1 Composite sheet of using wierless charging and fabricationg method the same
KR20160088844A Polyimide heat resistance adhesive having low dielectric constant and flexible laminated plate using the same
KR101672467B1 Improved impact resistant adhesive film for mobile device and manufacturing method there of
KR20160136226A Composite sheet with EMI shield and heat radiation and Manufacturing method thereof
KR101693797B1 Adhesive film for encapsulation member of organic electronic device and encapsulation member comprising the same
KR101687334B1 Adhesive film for organic electronic device and encapsulation member comprising the same
KR101665593B1 Adhesive film for organic electronic device and encapsulation member comprising the same
KR101567277B1 Encapsulant for organic electronic device and light-emitting apparatus comprising the same
KR101595696B1 Composition for non-conductive film and non-conductive film including the same
KR20150030684A Flexicle copper clad laminate producing apparatus with excellent anti-winkle effect
KR20150030683A Excellent size stability flexible copper clad laminate producing apparatus
KR20160083204A THERMOPLASTIC POLYIMIDE ADHESIVE FILM WITH EXCELLENT HIGH HEAT-RESISTANCE BY Water Absorption AND METAL CLAD LAMINATE USING THE SAME
KR20160083203A POLYIMIDE ADHESIVE FILM WITH HIGH FLEXIBILITY AND Flexible Copper Clad Laminate
KR101577686B1 adhesive resin for dicing die-bonding film, attach film for dicing die-bonding film including the same and dicing die-bonding film including the same
KR20160075895A Thermoplastic polyimide adhesive film with excellent slip property and flexible laminated plate including the same
KR101561103B1 Adhesive film for organic electronic device and encapsulation member comprising the same
WO2016080570A1 Encapsulant for organic electronic device, and light-emitting device including same
KR101522822B1 Encapsulant for organic electronic device and light-emitting apparatus comprising the same