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INNOX ADVANCED MAT CO LTD

Overview
  • Total Patents
    125
  • GoodIP Patent Rank
    11,438
  • Filing trend
    ⇧ 48.0%
About

INNOX ADVANCED MAT CO LTD has a total of 125 patent applications. It increased the IP activity by 48.0%. Its first patent ever was published in 2016. It filed its patents most often in Republic of Korea, China and Japan. Its main competitors in its focus markets basic materials chemistry, semiconductors and audio-visual technology are HENGSHAN COUNTY JIACHENG NEW MAT CO LTD, DONGGUAN ZHEHUA ELECTRONICS CO LTD and YOUNGWOO CO LTD.

Patent filings in countries

World map showing INNOX ADVANCED MAT CO LTDs patent filings in countries

Patent filings per year

Chart showing INNOX ADVANCED MAT CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lee Sang Pil 21
#2 Kim Joon Ho 20
#3 Choi Chang Hwon 20
#4 Roh Jung Sub 19
#5 Park Soon Chun 18
#6 Kong Lee Seong 17
#7 Yoo Sung Ju 16
#8 Kim Seong Geun 15
#9 Kweon Jeongmin 14
#10 Park Duck Ha 14

Latest patents

Publication Filing date Title
KR20200119749A Heat radiation sheet and EMI shielding-Heat radiation composite sheet comprising the same
KR20200120576A Heat radiation sheet and EMI shielding-Heat radiation composite sheet comprising the same
KR20210004881A interlayer insulating material for printed wiring board, interlayer insulating film containing the same and manufacturing method thereof
CN112185905A Film-wrapped chip adhesive film and semiconductor package including the same
JP2020076989A Fpic film, flexible printed circuit board having the same, and manufacturing method thereof
KR20210028938A Manufacturing method of encapsulation member for organic electronic device
KR20210017223A Encapsulation member of organic electronic device and Manufacturing method thereof
KR20210017224A Encapsulation member of organic electronic device and Manufacturing method thereof
KR20210012504A Fod adhesive film and semiconductor package comprising thereof
KR20210010147A EMI shielding-Heat radiation composite sheet and manufacturing method thereof
KR20190084230A Adhesive film for encapsulation member of organic electronic device and encapsulation member comprising the same
KR102059172B1 Adhesive film for encapsulation member of organic electronic device and encapsulation member comprising the same
KR20190082722A Adhesive film for encapsulation member of organic electronic device and encapsulation member comprising the same
KR20210002976A Fod adhesive film and semiconductor package comprising thereof
KR20210003352A Fod adhesive film and semiconductor package comprising thereof
KR20200117265A Heat radiation sheet and EMI shielding-Heat radiation composite sheet comprising the same
KR20200115924A flexible copper clad layer capable of use chip on film and flexible printed circuit board in common
KR20200097434A Heat radiation sheet and EMI shielding-Heat radiation composite sheet comprising the same
KR20200097136A Pressure Sensitive Adhesive composition using foldable display
KR20200097137A Pressure Sensitive Adhesive composition using foldable display