INDIANA INTEGRATED CIRCUITS LLC has a total of 21 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2014. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets semiconductors, optics and audio-visual technology are WU KAI-WEN, CHI MEI LIGHTING TECHNOLOGY CO and ADAMANDO KOGYO KK.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 13 | |
#2 | WIPO (World Intellectual Property Organization) | 3 | |
#3 | China | 2 | |
#4 | EPO (European Patent Office) | 1 | |
#5 | Republic of Korea | 1 | |
#6 | Taiwan | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Optics | |
#3 | Audio-visual technology | |
#4 | Environmental technology | |
#5 | Machines |
# | Name | Total Patents |
---|---|---|
#1 | Kulick Jason M | 20 |
#2 | Lu Tian | 15 |
#3 | Preble Stefan | 6 |
#4 | Fanto Michael | 6 |
#5 | Qian Yi | 6 |
#6 | Steidle Jeffrey | 6 |
#7 | Hopkins Douglas | 4 |
#8 | Bernstein Gary H | 2 |
#9 | Hoffman Anthony | 2 |
#10 | Hall Douglas C | 2 |
Publication | Filing date | Title |
---|---|---|
WO2020146578A1 | Edge interconnects for use with circuit boards and integrated circuits | |
CN109891290A | Method and system for fiber array and laser array or optical waveguide array to be aligned and be attached | |
US2017125389A1 | Edge interconnect self-assembly substrate | |
US2017127518A1 | Substrates with interdigitated hinged edge interconnects | |
US2017125350A1 | Prototyping of electronic circuits with edge interconnects | |
CN106575647A | Edge interconnect packaging of integrated circuits for power systems | |
US2014268592A1 | Method of interconnecting microchips | |
US9620473B1 | Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment |