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HYMITE AS

Overview
  • Total Patents
    72
About

HYMITE AS has a total of 72 patent applications. Its first patent ever was published in 2000. It filed its patents most often in United States, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets optics, semiconductors and micro-structure and nano-technology are DIGITALOPTICS CORP EAST, CHI MEI LIGHTING TECHNOLOGY CO and ADAMANDO KOGYO KK.

Patent filings per year

Chart showing HYMITE ASs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Heschel Matthias 21
#2 Kilian Arnd 21
#3 Shiv Lior 15
#4 Hauffe Ralf 8
#5 Blidegn Kristian 8
#6 Kuhmann Jochen 8
#7 Murphy Thomas 8
#8 Kuhmann Jochen Friedrich 4
#9 Winter Marcus 3
#10 Greisen Christoffer Graae 3

Latest patents

Publication Filing date Title
WO2010092042A2 Silicon-based sub-mount for an opto-electronic device
US2010176507A1 Semiconductor-based submount with electrically conductive feed-throughs
WO2009089996A1 Fabrication of compact semiconductor packages
US2009194777A1 Optoelectronic device submount
WO2008083905A1 Spacers for wafer bonding
US2008199982A1 Fabrication process for package with light emitting device on a sub-mount
US2008076195A1 Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane
WO2007054819A2 Sealed package with glass window for optoelectronic components and assemblies incorporating the same
US2007170450A1 Package for a light emitting element with integrated electrostatic discharge protection
KR20070064339A Optical module hermetically packaged in micro-machined structures
US2007035001A1 Method of fabrication for chip scale package for a micro component
US2006283836A1 Fabrication and use of polished silicon micro-mirrors
WO2005118464A1 Microelectromechanical systems (mems) devices integrated in a hermetically sealed package
US2006210234A1 Method of fabricating a package for a micro component
WO2005043602A2 Three-dimensional inductive micro components
US2005236562A1 Assembly with self-alignment features to position a cover on a substrate that supports a micro component
US2005241135A1 Method of forming an assembly to house one or more micro components
US7109580B2 Hermetically sealed package for optical, electronic, opto-electronic and other devices
US7165896B2 Light transmitting modules with optical power monitoring
WO2004008201A2 Accurate positioning of components of an optical assembly