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HYUNDAI MICRO ELECTRONICS CO

Overview
  • Total Patents
    5,764
About

HYUNDAI MICRO ELECTRONICS CO has a total of 5,764 patent applications. Its first patent ever was published in 1989. It filed its patents most often in Republic of Korea, United States and Germany. Its main competitors in its focus markets semiconductors, computer technology and basic communication technologies are LG SEMICON CO LTD, FUJITSU MICROELECTRONICS LTD and CHANGXIN MEMORY TECHNOLOGIES INC.

Patent filings in countries

World map showing HYUNDAI MICRO ELECTRONICS COs patent filings in countries
# Country Total Patents
#1 Republic of Korea 5,752
#2 United States 9
#3 Germany 2
#4 Taiwan 1

Patent filings per year

Chart showing HYUNDAI MICRO ELECTRONICS COs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lee Chang-Jae 40
#2 Lee Sang-Don 24
#3 Han Suk-Bin 17
#4 Kim Jong-Kwan 16
#5 Kang Hui Bok 14
#6 Lee Chang Jae 14
#7 Park Yong 13
#8 Park Chan 12
#9 Kang Chang Yong 11
#10 Son Dong Gyun 11

Latest patents

Publication Filing date Title
KR20000023855A Semiconductor memory device
KR20010036888A tube-washer for the reaction-film deposition progress to make a semi-conductor element
KR20010036823A Method of isolating semiconductor device
KR20010036821A Method of fabricating capacitor
KR20010036820A method of fabricating capacitor
KR20010036822A Method for isolating semiconductor devices
KR20010036727A Nonvolatile memory device and method for manufacturing the same
KR20010036730A Semiconductor Etching Equipment
KR20010036728A Semiconductor circuit
KR20010036729A Flash memory device
KR20010036556A Manufacturing method for cell transistor in dram
KR20010036555A High speed level shifter
KR20010036564A Semiconductor chemical main line cleaning device
KR20010036567A Apparatus for preventing superheating and contamination of semiconductor chemical vapor deposition
KR20010036553A Stacked ball grid array package and manufacturing method thereof
KR20010036558A Manufacturing method for isolation in semiconductor device
KR20010036557A Manufacturing method for isolation in semiconductor device
KR20010036552A Apparatus for removing particle of semiconductor wafer rinse system
KR20010036551A Stacked micro ball grid array package and fabricating method thereof
KR20010036554A Stacked buttom lead package and manufacturing method thereof