| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 5 | |
| #2 | Taiwan | 3 | |
| #3 | WIPO (World Intellectual Property Organization) | 3 | |
| #4 | Australia | 2 | |
| #5 | EPO (European Patent Office) | 2 |
| # | Industry | |
|---|---|---|
| #1 | Measurement | |
| #2 | Semiconductors |
| # | Technology | |
|---|---|---|
| #1 | Analysing materials | |
| #2 | Semiconductor devices | |
| #3 | Measuring length, angles and areas |
| # | Name | Total Patents |
|---|---|---|
| #1 | Kurtz David S | 15 |
| #2 | Moran Paul R | 14 |
| #3 | Kozaczek Krzysztof J | 13 |
| #4 | Martin Roger I | 8 |
| #5 | Dehaven Patrick W | 4 |
| #6 | Rodbell Kenneth P | 3 |
| #7 | Malhotra Sandra G | 3 |
| #8 | Kozaczek Kryzsztof J | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US6792075B2 | Method and apparatus for thin film thickness mapping | |
| US6678347B1 | Method and apparatus for quantitative phase analysis of textured polycrystalline materials | |
| US6882739B2 | Method and apparatus for rapid grain size analysis of polycrystalline materials | |
| US6301330B1 | Apparatus and method for texture analysis on semiconductor wafers |