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HUNAN REDSOLAR PHOTOELECTRIC TECHNOLOGY CO LTD

Overview
  • Total Patents
    12
About

HUNAN REDSOLAR PHOTOELECTRIC TECHNOLOGY CO LTD has a total of 12 patent applications. Its first patent ever was published in 2011. It filed its patents most often in China. Its main competitors in its focus markets environmental technology are GLAZOV MIKHAIL N, GUANGXI SUNWAY FOREST PRODUCTS INDUSTRY CO LTD and FEDERAL NOE GUP NPO ORION.

Patent filings in countries

World map showing HUNAN REDSOLAR PHOTOELECTRIC TECHNOLOGY CO LTDs patent filings in countries
# Country Total Patents
#1 China 12

Patent filings per year

Chart showing HUNAN REDSOLAR PHOTOELECTRIC TECHNOLOGY CO LTDs patent filings per year from 1900 to 2020

Focus industries

Focus technologies

Top inventors

# Name Total Patents
#1 Wei Wei 4
#2 Jia Jingying 3
#3 Ning Zonge 3
#4 Wang Huiyong 2
#5 Tang Chaofan 2
#6 Wang Xueshi 2
#7 Lv Wenli 2
#8 Ziyou Zhou 1
#9 Xianjin Liu 1
#10 Jin Guo 1

Latest patents

Publication Filing date Title
CN103199128A High-temperature resistant and low-warpage aluminum paste
CN102945795A Preparation method of wide-forbidden-band semiconductor flexible substrate
CN102634800A Washing method of washing-difficult reworked piece of crystalline silicon solar battery
CN102602703A Screen printing machine and linear conveying mechanism for same
CN102517171A Cleaning liquid for solar cell silicon chip and using method thereof
CN102328827A Graphite boat trolley for plasma enhanced chemical vapor deposition (PECVD) automatic wafer loading and unloading system
CN102327872A Slice box for testing and separating equipment of crystalline silicon solar cell slices
CN102328492A Screen spacing adjustment system for screen printer and screen printer
CN102332487A Transplanting and sucking device of full-automatic solar cell testing and separation equipment
CN102332420A Ultrathin umbrella-flow-type non-contact silicon wafer sucking disc
CN102332488A Method and apparatus for laser edge isolation of crystalline silicon solar cells
CN102332423A Process for reducing chemical-mechanical polishing crack on buried layer cavity silicon-on-insulator (SOI) wafer