Learn more

HUAYA MICROELECTRONICS SH

Overview
  • Total Patents
    37
About

HUAYA MICROELECTRONICS SH has a total of 37 patent applications. Its first patent ever was published in 2003. It filed its patents most often in China and United States. Its main competitors in its focus markets audio-visual technology, computer technology and semiconductors are TEKNOWLEDGE DEV CORP, LEE SEUNG-YUN and SEKINE HIROKAZU.

Patent filings in countries

World map showing HUAYA MICROELECTRONICS SHs patent filings in countries
# Country Total Patents
#1 China 36
#2 United States 1

Patent filings per year

Chart showing HUAYA MICROELECTRONICS SHs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Zhu Ge 7
#2 Zhong Sheng 5
#3 Hao Yin 5
#4 Qi Dong 5
#5 Lan Liu 5
#6 Zhu Ke Chen 2
#7 Chen Yan 2
#8 Yidong Chen 2
#9 Ge Zhu 2
#10 Xu Jie 1

Latest patents

Publication Filing date Title
CN102707948A Source code generation method
CN102497491A Component video signal input system
CN102395019A Deinterlacing method
CN102340464A Automatic detection method of dynamic and static multi-path channels
CN102088543A Peaking method and device based on multi-band-pass filtering
CN102005051A Edge detection method and related device
CN101980521A Image sharpening method and related device
CN101980543A Two-dimensional comb filter and luminance and chrominance separation method
CN102004626A Dual-port memory
CN101895312A Pseudo random code sequence phase capturing method and capturing device
CN101763137A Current generating circuit
CN101707677A osd controller
CN101557518A Method and device for compensating motion, method and device for replacing cache
CN101515235A Programming system and data processing system
CN101515234A Associated data processing method and associated data device
CN101504606A Associated data chain apparatus and its data processing method
CN101504607A Window state manager and method, window management system and method
CN101504608A Multimedia signal input processing method
CN101482896A Simulation method
CN101404279A Multi-chip 3D stacking and packaging structure