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HIGH POWER LIGHTING CORP

Overview
  • Total Patents
    25
  • GoodIP Patent Rank
    181,553
About

HIGH POWER LIGHTING CORP has a total of 25 patent applications. Its first patent ever was published in 2005. It filed its patents most often in Taiwan, China and United States. Its main competitors in its focus markets semiconductors, electrical machinery and energy and audio-visual technology are CREE HONG KONG LTD, LUSTROUS TECHNOLOGY LTD and BRIGHTEK OPTOELECTRONIC SHENZHEN CO LTD.

Patent filings in countries

World map showing HIGH POWER LIGHTING CORPs patent filings in countries
# Country Total Patents
#1 Taiwan 12
#2 China 6
#3 United States 6
#4 Germany 1

Patent filings per year

Chart showing HIGH POWER LIGHTING CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wu Ming-Chang 13
#2 Wei Chih-Hung 12
#3 Hsu Chih-Yang 6
#4 Wu Jian Yang 4
#5 Lin Cheng 3
#6 Wen Pu 3
#7 Wu Jian-Yang 3
#8 Wu Chih-Lung 3
#9 Zhihong Wei 3
#10 Mingchang Wu 3

Latest patents

Publication Filing date Title
TW201802390A Lighting module
US2016377277A1 Fluid cooled lamp
TW201706554A Mesh-type heat dissipation structure and heat dissipation device having the same
TW201706542A Heat sink for high power light emitting diode
TW201700916A Led lamp
TWI538364B Liquid cooling heat sink
US2011216555A1 Led device for backlight module
US2011049539A1 Light-Emitting Diode With High Color-Rendering Index
US7812624B1 Testing method for LED module
US2010259937A1 Candle Lighting Type Reflective Lampshade
TW201038131A Testing apparatus and method for led module
CN101852674A Detecting equipment and method of luminous module
CN101788107A Radiating block component and light emitting diode comprising same
TW201029123A A heat dissipative assembly and a light emitting diode package including a heat dissipative block
CN101769496A Nonaxisymmetrical optical device
TW201013108A Non-axially symmetrical optical device
CN101308893A Grain binding material and method for light emitting diode
TW200840079A Eutectic bonding material of LED and packaging method
DE102007002916A1 High speed-LED-chip-housing structure, has reflection plate adhered to top side of base by adhesive, where reflection plate includes vertical through hole with opening, such that top sides of seat and electrodes are opened
CN101226975A High-power light emitting diode chip packaging structure and method for manufacturing the same