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HF SMAT MICROTECH COMPANY

Overview
  • Total Patents
    15
  • GoodIP Patent Rank
    113,584
About

HF SMAT MICROTECH COMPANY has a total of 15 patent applications. Its first patent ever was published in 2015. It filed its patents most often in China. Its main competitors in its focus markets semiconductors are SHENZHEN FANGDA GUOKE OPTOELEC, WILL SEMICONDUCTOR LTD and JIAXING STARPOWER MICROELECTRONICS CO LTD.

Patent filings in countries

World map showing HF SMAT MICROTECH COMPANYs patent filings in countries
# Country Total Patents
#1 China 15

Patent filings per year

Chart showing HF SMAT MICROTECH COMPANYs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Tan Xiaochun 11
#2 Zhang Guangyao 7
#3 Yao Lanzhong 5
#4 Lu Peiliang 3
#5 Gao Yang 2

Latest patents

Publication Filing date Title
CN110556343A Packaging structure and packaging process for preventing layering
CN110581079A Fan-out type chip packaging method and fan-out type chip packaging body
CN110517963A A kind of ring membrane structure Shooting Technique
CN110473795A A kind of the layering insulation package structure and technique of large size chip
CN110504177A A kind of BGA ball-establishing method
CN110349857A Side wall reveals copper encapsulating structure and its manufacture craft
CN110517962A Attached metal wrapping encapsulating structure in five faces and preparation method thereof
CN110364444A Attached metal wrapping encapsulating structure in three faces and preparation method thereof
CN109659278A Multichip stacking encapsulation method and Multichip stacking encapsulation body
CN109671635A Chip packaging method and packaging body
CN109378294A The packaging method of semiconductor structure
CN109148405A Carrier and the chip-packaging structure for using the carrier
CN109065515A The chip-packaging structure and preparation method thereof of highly conductive low resistance
CN108878297A Chip-packaging structure and preparation method thereof
CN109904127A Encapsulating structure and packaging method