HENKEL AG & AMP CO KGAA has a total of 25 patent applications. Its first patent ever was published in 2008. It filed its patents most often in Republic of Korea and Taiwan. Its main competitors in its focus markets basic materials chemistry, macromolecular chemistry and polymers and surface technology and coating are HENKEL AG & CO KG, NANJING NUOBANG NEW MAT CO LTD and CHEM LINK INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | Republic of Korea | 22 | |
#2 | Taiwan | 3 |
# | Industry | |
---|---|---|
#1 | Basic materials chemistry | |
#2 | Macromolecular chemistry and polymers | |
#3 | Surface technology and coating | |
#4 | Machines | |
#5 | Semiconductors |
# | Technology | |
---|---|---|
#1 | Adhesives | |
#2 | Macromolecular compounds compositions | |
#3 | Special macromolecular compounds | |
#4 | Unspecified technologies | |
#5 | Soaps | |
#6 | Layered products | |
#7 | Compounding ingredients | |
#8 | Coating compositions | |
#9 | Semiconductor devices | |
#10 | Coating metallic material |
# | Name | Total Patents |
---|---|---|
#1 | Mcardle Ciaran | 3 |
#2 | Barriau Emilie | 3 |
#3 | Bammel Brian D | 2 |
#4 | Wucherpfennig Sven | 2 |
#5 | Renkel Martin | 2 |
#6 | Moeller Thomas | 2 |
#7 | Sterrett Terry | 2 |
#8 | Engels Thomas | 2 |
#9 | Parals Maria | 2 |
#10 | Lammerschop Olaf | 2 |
Publication | Filing date | Title |
---|---|---|
TW201206668A | Preformed film | |
TW201208071A | Method for handling a wafer | |
TW201211054A | Printable materials and methods of manufacture thereof | |
KR20120034080A | Electrically conductive adhesives | |
KR20110123255A | Method for sealing and acoustic damping of longitudinal cavities, and insert used therefore |