| # | Country | Total Patents | |
|---|---|---|---|
| #1 | China | 21 |
| # | Industry | |
|---|---|---|
| #1 | Macromolecular chemistry and polymers | |
| #2 | Basic materials chemistry | |
| #3 | Machines | |
| #4 | Surface technology and coating |
| # | Name | Total Patents |
|---|---|---|
| #1 | Takamori Ai | 3 |
| #2 | Hayakawa Tadashi | 3 |
| #3 | Salet Lisa K | 1 |
| #4 | Erban Jens | 1 |
| #5 | Braam Johannes Hendrikus Gerhardus Franciscus | 1 |
| #6 | Gabriele Hecht | 1 |
| #7 | Kok Douwe-Marten | 1 |
| #8 | Odink Gerrit Jan | 1 |
| #9 | Meckel-Jonas Claudia | 1 |
| #10 | Klophaus Katja | 1 |
| Publication | Filing date | Title |
|---|---|---|
| CN106133039A | Heat-swellable compositions | |
| CN106170850A | The method of preparation semiconductor packages and contactless upwards spraying system purposes in preparation semiconductor packages | |
| CN102686692A | Water-based adhesive for lamination of polymers to metal substrates |