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GUANGDONG DANBOND TECHNOLOGY CO LTD

Overview
  • Total Patents
    32
  • GoodIP Patent Rank
    67,254
About

GUANGDONG DANBOND TECHNOLOGY CO LTD has a total of 32 patent applications. Its first patent ever was published in 2013. It filed its patents most often in China and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets audio-visual technology, basic materials chemistry and electrical machinery and energy are COATES BROTHERS PLC, SHINTO PAINT CO LTD and PRINTCB LTD.

Patent filings in countries

World map showing GUANGDONG DANBOND TECHNOLOGY CO LTDs patent filings in countries

Patent filings per year

Chart showing GUANGDONG DANBOND TECHNOLOGY CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Zhang Shuangqing 23
#2 Liu Ping 16
#3 Hu Gang 10
#4 Yang Yongyuan 1

Latest patents

Publication Filing date Title
CN104559882A Liquid crystal epoxy underfill adhesive and preparation method thereof
CN104582242A Reinforcement plate for supporting and reinforcing flexible printed circuit board
CN104559883A Epoxy die-bonding adhesive and preparation method thereof and multi-chip embedded flexible printed circuit board
CN104559056A Heat-curable solder resist composition and flexible printed circuit board
CN104562115A Black hole liquid for printed circuit board and preparation method of black hole liquid
CN104562013A Copper etching solution and method for manufacturing printed circuit board
CN104558604A Method for preparing soluble polyimide by chemical imidization
CN104561951A Method and plating solution for chemical plating of nickel phosphorus alloy, and nickel phosphorus alloy layer
CN104694909A Copper surface coarsening agent
CN104693965A Composition for preventing ionic migration and preparation method, non-gel substrate and preparation method
CN104714365A Photosensitive composition and photoresist
CN104672785A Epoxy molding compound and preparation method thereof
CN104673160A Filled surface modified silicon carbide isotropic thermal conduction adhesive and preparation method thereof
CN104672448A Polyimide resin and application thereof, two-layer adhesiveless base material and preparation method of two-layer adhesiveless base material
CN104678704A Water-soluble eurymeric photosensitive polyimide and method for preparing pattern film
CN104673111A Formula and preparation method of epoxy resin based anisotropic conductive adhesive film
CN104559891A Non-conductive adhesive and gold-gold quick interconnection method
CN104710871A Alkaline-developable photosensitive solder resist ink for FPC, preparation method, application and product
CN104981102A Multi-chip-embedded flexible printed circuit board and manufacturing method thereof
CN104975269A Tantalum-sourced precursor, preparation method of tantalum-sourced precursor and preparation method of TaN film resistance