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DYMAX CORP

Overview
  • Total Patents
    157
  • GoodIP Patent Rank
    54,767
About

DYMAX CORP has a total of 157 patent applications. Its first patent ever was published in 1980. It filed its patents most often in United States, EPO (European Patent Office) and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets basic materials chemistry, macromolecular chemistry and polymers and audio-visual technology are COATES BROTHERS PLC, HANSE CHEMIE AG and COATES BROTHERS & CO.

Patent filings per year

Chart showing DYMAX CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Bachmann Andrew G 37
#2 Cantor Stephen E 33
#3 Platzer Stephan J W 16
#4 Rahim Marufur 15
#5 Matzuk Terrance 14
#6 Nebioglu Ahmet 13
#7 Arnold John R 13
#8 Nebioglu Aysegul Kascatan 11
#9 Audia Maria Fe Aton 11
#10 Grosclaude Gary V 11

Latest patents

Publication Filing date Title
US2016333126A1 Dual cure acrylic formulations and methods to cure thereof
SG10201404717TA High temperature resistance, radiation curable maskant for metal substrates
CA2858795A1 Form in-place gasket with tack free surface
US2015376476A1 Actinic radiation and moisture dual curable composition
US2015284589A1 Sunlight curable coating compositions
US2015099818A1 Tri-curable adhesive composition and method
EP2400324A1 Exposure device having an array of light emitting diodes
US2009190349A1 Light guide exposure device
US2009110844A1 Photopolymerizable compositions containing an oxonol dye
US2009050264A1 Radiation-curable fluorescing compositions
US2008175001A1 Light exposure control device and apparatus
WO2006052598A2 Vinyl amide-containing adhesive compositions for plastic bonding, and methods and products utilizing same
US2007004836A1 Polymerizable composition exhibiting permanent color change as cure indicator
US7001930B2 Acrylic resin formulations curable to clear, heat-resistant bodies
US6664307B2 Low-shrinkage epoxy resin formulation
US6765037B2 Photopolymerizable epoxy composition
WO0204549A1 Heat-resistant formulation and method for using same
WO0040155A1 Slotted needle guide
US6218446B1 Radiation curable formulation for producing electrically conductive resinous material, method of use, and article produced
US6169125B1 Electrically conductive resinous material and radiation curable formulation for producing the same