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FUSHENG ELECTRONICS CORP

Overview
  • Total Patents
    23
  • GoodIP Patent Rank
    174,977
  • Filing trend
    ⇧ 100.0%
About

FUSHENG ELECTRONICS CORP has a total of 23 patent applications. It increased the IP activity by 100.0%. Its first patent ever was published in 2008. It filed its patents most often in Taiwan, China and Republic of Korea. Its main competitors in its focus markets semiconductors, engines, pumps and turbines and machines are JAGANNATHAN HEMANTH, CHEN CHI-MING and OGANESIAN VAGE.

Patent filings in countries

World map showing FUSHENG ELECTRONICS CORPs patent filings in countries
# Country Total Patents
#1 Taiwan 16
#2 China 5
#3 Republic of Korea 1
#4 United States 1

Patent filings per year

Chart showing FUSHENG ELECTRONICS CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Chu Chen Feng 9
#2 Chen Yuan Fu 9
#3 Chu Chen-Feng 8
#4 Chen Yuan-Fu 8
#5 Zhu Zhenfeng 3
#6 Chen Yuanfu 3
#7 Hu Chun-Liang 3
#8 Liu Ying-Chou 2
#9 Chen Chi Jen 1
#10 Liu Yingzhou 1

Latest patents

Publication Filing date Title
US2019341340A1 Mounting rack with circuit
TW201947114A Sinking type gas storage plate
TWI653724B Leadframe structure with die-mount stage
TW201901894A Method for manufacturing lead frame with line and structure thereof
TWI623076B Method for manufacturing leadframe
TW201521235A Frame structure for lateral led
TW201419586A Method for manufacturing led leadframe
TW201409776A Method for manufacturing thermosetting led leadframe
TW201403894A Method for manufacturing LED leadframe
TW201403895A Method for manufacturing led leadframe
TW201403890A Method for manufacturing LED leadframe
CN103000773A Light emitting diode support structure and manufacturing method thereof
CN103000772A Light emitting diode support structure manufacturing method
TW201310732A Method for making mounting frame for led
TW201310714A Mounting frame for led and method for making the same
KR101223261B1 Method for manufacturing support of thermosetting plastic light emitting diode
TW201306311A Frame structure for led
TW201304216A A method for manufacturing lead frame of thermosetting resin light emitting diode
TW201415682A A method for manufacturing lead frame of thermosetting resin light emitting diode
TW200945618A Led frame structure and its forming method