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ELECTROVAC

Overview
  • Total Patents
    369
About

ELECTROVAC has a total of 369 patent applications. Its first patent ever was published in 1969. It filed its patents most often in Austria, Germany and United States. Its main competitors in its focus markets electrical machinery and energy, materials and metallurgy and semiconductors are VISHAY RESISTORS BELGIUM BVBA, AMERICAN LAVA CORP and JIANG HAIQING.

Patent filings per year

Chart showing ELECTROVACs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Bayer Helmut 39
#2 Bayer Helmut Dipl Ing 35
#3 Morbitzer Hans-Peter 32
#4 Schmitt Theodore Nicolas 27
#5 Hammel Ernst 24
#6 Nechansky Helmut 19
#7 Schmitt Theodore 16
#8 Tang Xinhe 14
#9 Nechansky Helmut Dr 14
#10 Thumfart Dieter 14

Latest patents

Publication Filing date Title
AT501760A4 Arrangement for pressure measurement
EP1696404A1 Light emitting diode assembly
AT501383A1 Preparing gas mixture, used for producing e.g. nanofibers, comprises supplying feed gas in reformer and secondary reformer, contacting nano-structured catalyst with feed gas, and combining carbon monoxide and carbon dioxide free exhaust gas
WO2004081506A2 Sealed sensor housing
EP1569257A1 Temperature sensor
US2004245910A1 Field emission backlight for liquid crystal television
ATA17092003A Heating element for electric heating plates and method for producing a heating element
ATA6892003A Method for treating reinforcing elements
ATA3622003A PROBE
WO03070821A2 Flame retardant polymer composites and method of fabrication
GB0226900D0 Method of synthesising carbon nano tubes
ATA17052002A Heat extraction component
ATA7262002A Production system
EP1251540A2 Temperature limiter
ATA2792002A PROBE
ATA4212001A Catalytic chemical vapor deposition, used in production of tubular carbon nano-fibers, comprises applying nickel- or cobalt-based catalyst layer to carrier without using current
EP1241148A1 Aluminium nitride substrate and method of preparing this substrate for joining with a copper foil
EP1223597A1 Temperature limiter
EP1159752A1 Cathode structure for a field emission display
ATA194799A Process for producing a thermal shock-resistant copper layer on a ceramic substrate