EKWB D O O has a total of 15 patent applications. It increased the IP activity by 75.0%. Its first patent ever was published in 2016. It filed its patents most often in EPO (European Patent Office), WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets audio-visual technology, thermal processes and semiconductors are ABACO SYSTEMS INC, I O DATA CT S LLC and ASETEK DANMARK AS.
# | Country | Total Patents | |
---|---|---|---|
#1 | EPO (European Patent Office) | 5 | |
#2 | WIPO (World Intellectual Property Organization) | 4 | |
#3 | China | 3 | |
#4 | United States | 3 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Thermal processes | |
#3 | Semiconductors | |
#4 | Basic materials chemistry | |
#5 | Computer technology |
# | Name | Total Patents |
---|---|---|
#1 | Tivadar Niko | 11 |
#2 | Oblak Rok | 4 |
#3 | Harper Daniel George | 3 |
#4 | König Edvard | 2 |
#5 | Robey Joe | 1 |
#6 | Konig Edvard | 1 |
Publication | Filing date | Title |
---|---|---|
US2020363846A1 | Liquid cooling system | |
EP3564992A1 | Fluid-based cooling device for cooling at least two distinct first heat-generating elements of a heat source assembly | |
EP3379908A1 | Method for manufacturing a fluid-based cooling element and fluid-based cooling element | |
EP3369797A1 | Cooling liquid composition for a liquid cooling system for cooling a heat generating element arranged on a printed circuit board | |
EP3273323A1 | Computer liquid cooling system and method of use | |
EP3344025A1 | Fluid-based cooling element for cooling a heat generating element arranged on a printed circuit board |