| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United Kingdom | 7 | |
| #2 | EPO (European Patent Office) | 3 | |
| #3 | Switzerland | 1 | |
| #4 | Hong Kong | 1 | |
| #5 | Singapore | 1 |
| # | Industry | |
|---|---|---|
| #1 | Measurement | |
| #2 | Audio-visual technology | |
| #3 | Semiconductors | |
| #4 | Machine tools | |
| #5 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Analysing materials | |
| #2 | Casings and printed circuits | |
| #3 | Semiconductor devices | |
| #4 | Soldering, welding and flame cutting | |
| #5 | Measuring volume | |
| #6 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Green Graham William | 2 |
| #2 | Griffiths Brian | 2 |
| #3 | Cable Michael John | 2 |
| #4 | Dane Derek Robert | 2 |
| #5 | Ainsworth Steven Jeffrey Hume | 2 |
| #6 | Wright Robert James | 2 |
| #7 | Lock Graham Douglas | 1 |
| #8 | Golby John Andrew | 1 |
| Publication | Filing date | Title |
|---|---|---|
| GB8927655D0 | Die eject head | |
| GB8927656D0 | Die eject unit | |
| GB8920130D0 | Sensing device | |
| GB8911670D0 | Adaptor | |
| GB8911594D0 | Automatic die bonding machine | |
| GB8911593D0 | Automatic die bonding machine | |
| GB8911464D0 | Method of setting up apparatus for handling electrical or electronic components | |
| EP0326236A2 | Method of setting up apparatus for handling electrical or electronic components |