DUBIN VALERY M has a total of 14 patent applications. Its first patent ever was published in 2004. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors, micro-structure and nano-technology and surface technology and coating are FUKUDA TOMOYUKI, ERFURT MIKROELEKTRONIK and UNIV HOSEI.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 14 |
# | Name | Total Patents |
---|---|---|
#1 | Dubin Valery M | 14 |
#2 | Gstrein Florian | 2 |
#3 | Bohr Mark | 2 |
#4 | Barnett Brandon | 2 |
#5 | Balakrishnan Sridhar | 2 |
#6 | Holt Gordon D | 2 |
#7 | Emery Richard D | 1 |
#8 | Fang Ming | 1 |
#9 | Chowdhury Shaestagir | 1 |
#10 | Akolkar Rohan N | 1 |
Publication | Filing date | Title |
---|---|---|
US2012199491A1 | Methods for electroplating copper | |
US2009000957A1 | Gel-based bio chip for electrochemical synthesis and electrical detection of polymers | |
US2008026555A1 | Sacrificial tapered trench opening for damascene interconnects | |
US2008003366A1 | Method of forming a conducting layer on a conducting and non-conducting substrate | |
US2006063382A1 | Method to fabricate copper-cobalt interconnects | |
US2005277281A1 | Compliant interconnect and method of formation |