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CRUCIALMACHINES CO LTD

Overview
  • Total Patents
    39
  • GoodIP Patent Rank
    38,964
  • Filing trend
    ⇩ 80.0%
About

CRUCIALMACHINES CO LTD has a total of 39 patent applications. It decreased the IP activity by 80.0%. Its first patent ever was published in 2015. It filed its patents most often in Republic of Korea, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets semiconductors, machine tools and measurement are ZEN VOCE CORP, LEI WEI-SHENG and KOREA SEMICINDUCTOR SYSTEM CO LTD.

Patent filings in countries

World map showing CRUCIALMACHINES CO LTDs patent filings in countries

Patent filings per year

Chart showing CRUCIALMACHINES CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Choi Jae Joon 21
#2 Choi Ji Hoon 17
#3 Kim Byung Rock 13
#4 Cho Wan Ki 10
#5 Kim Dong Cheol 6
#6 Sung Jong Hun 6
#7 Cho Sung Yoon 6
#8 Kim Nam Seong 6
#9 Kim Ki Suk 6
#10 Kim Byoung Cheol 5

Latest patents

Publication Filing date Title
KR20190008822A Laser reflow apparatus
KR20190030113A Apparatus for removing an electronic device from a pcb board
KR101937360B1 Laser reflow apparatus
TW201815505A Pressure head for flip chip bonder and pressure assembly containing the same
KR20180076544A Laser reflow method
KR20180043589A Optical homogenization device and laser bonding apparatus containing the same
KR101816291B1 Laser bonding apparatus for three-dimensional molded sculptures
WO2017023130A1 Probe pin bonding apparatus
KR20170140477A Laser reflow method and substrate structure thereby
KR20170140480A Optical homogenization device
KR20170140479A Reel to reel laser reflow method
KR20170140476A Laser reflow method and substrate structure thereby
KR20170128744A Probe pin laser bonding device and method
KR101748582B1 Straight degree inspection apparatus and method for probe pin
KR101779489B1 Apparatus for manufacturing semiconductor package
KR101785563B1 Zig assembly for manufacturing apparatus for external semiconductor package
KR20170017693A Probe pin bonding device
KR20170017044A Soldering device for camera module