Method of making through via on glass substrate including the steps of laser processing the glass substrate, immersing the glass substrate in an etching bath, ultrasonic vibrating the etching bath to remove the transformed structure area, and continuously etching
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Transparent substrate having hole and method for manufacturing the same in which a pulse laser beam is applied to focus on a transparent substrate positioned on a light-transmitting surface of an optic protection film to make a through hole extending through the transparent substrate
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Slotting method for suppressing defects capable of preventing cracks generated by dividing a wafer from exceeding a metamorphic region and avoiding grain defects
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Wafer leveling chuck structure and method thereof by applying secondary wafer leveling to enhance flatness of processed portion
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Calibration laser printing method
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Cutting method for preventing crack extension ensuring that cracks generated by cutting the wafer may not exceed the first metamorphic region by utilizing the first metamorphic region and avoiding grain defects
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Dust collecting device for laser processing thereby to achieve the effect of removing the flying matters and to avoid affecting the laser cutting head contamination and further improve the cutting quality
