CRISP RICHARD DEWITT innovation strategy

Patent filings in countries

#	Country	Total Patents
#1	United States	19

#	Technology
#1	Semiconductor devices
#2	Static stores
#3	Electric digital data processing
#4	Casings and printed circuits
#5	Climate change mitigation in goods production

Publication	Filing date	Title
US2013082391A1	2012-04-05	Stub minimization for wirebond assemblies without windows
US2013083583A1	2012-04-05	Stub minimization for multi-die wirebond assemblies with parallel windows
US2013082396A1	2012-04-05	Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
US2013082395A1	2012-04-04	Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
US2013082375A1	2012-04-04	Stub minimization for assemblies without wirebonds to package substrate
US2013082394A1	2011-12-27	Stub minimization for multi-die wirebond assemblies with parallel windows
US2013015586A1	2011-11-29	De-skewed multi-die packages