COOLER MASTER DEV CORP has a total of 17 patent applications. Its first patent ever was published in 2011. It filed its patents most often in United States, Taiwan and Germany. Its main competitors in its focus markets thermal processes, machine tools and semiconductors are ACMECOOLS TECH LTD, FERRAZ DATE IND and PIMEMS INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 9 | |
#2 | Taiwan | 4 | |
#3 | Germany | 2 | |
#4 | EPO (European Patent Office) | 1 | |
#5 | Malaysia | 1 |
# | Industry | |
---|---|---|
#1 | Thermal processes | |
#2 | Machine tools | |
#3 | Semiconductors | |
#4 | Machines | |
#5 | Materials and metallurgy | |
#6 | Computer technology | |
#7 | Engines, pumps and turbines | |
#8 | Mechanical elements |
# | Technology | |
---|---|---|
#1 | Heat-exchanger without contact | |
#2 | Heat-exchange device details | |
#3 | Metal-working | |
#4 | Unspecified technologies | |
#5 | Semiconductor devices | |
#6 | Punching metal | |
#7 | Casting metal | |
#8 | Electric digital data processing | |
#9 | Shafts | |
#10 | Non-positive-displacement pumps |
# | Name | Total Patents |
---|---|---|
#1 | Lin Chia-Yu | 5 |
#2 | Liu Lei-Lei | 4 |
#3 | Lin Chia Yu | 2 |
#4 | Chen Chang-Yin | 2 |
#5 | Zhou Chun | 2 |
#6 | Sun Chien-Hung | 2 |
#7 | Tsai Yen | 2 |
#8 | Lin Chun Hung | 1 |
#9 | Yen Lin-Chuan | 1 |
#10 | Yuan-Chin Cheng | 1 |
Publication | Filing date | Title |
---|---|---|
US2015013928A1 | Method for manufacturing heat-dissipating module | |
US2014345136A1 | Heat dissipating fin, heat dissipating device and method of manufacturing the same | |
US2014131014A1 | Heat dissipating device | |
US2014112775A1 | Fan and bearing thereof | |
US2014060793A1 | Plate-type heat exchanger and support structure thereof | |
US2015022069A1 | Storage device carrier | |
DE102013102272A1 | Method and system for configuring peripheral devices and computer-readable storage medium | |
TW201430310A | Heat dissipating device and method of manufacturing the same | |
EP2620239A1 | Heat-dissipating module and method for manufacturing the same | |
TW201323114A | Thermal dissipation module and method of manufacturing the same | |
MY156164A | Cooling pad | |
TW201319508A | Heat dissipating fin, heat dissipating device and method of manufacturing the same | |
TW201312329A | Heat-dissipating device and assembling method thereof |