HUANG TSUNG HSIEN has a total of 29 patent applications. It increased the IP activity by 150.0%. Its first patent ever was published in 2009. It filed its patents most often in Taiwan, Japan and Germany. Its main competitors in its focus markets thermal processes, audio-visual technology and machine tools are PIMEMS INC, TECHNOLOGIES DE L ECHANGE THER and TITANX HOLDING AB.
# | Country | Total Patents | |
---|---|---|---|
#1 | Taiwan | 16 | |
#2 | Japan | 9 | |
#3 | Germany | 2 | |
#4 | United States | 2 |
# | Industry | |
---|---|---|
#1 | Thermal processes | |
#2 | Audio-visual technology | |
#3 | Machine tools | |
#4 | Semiconductors | |
#5 | Machines | |
#6 | Computer technology | |
#7 | Mechanical elements |
# | Technology | |
---|---|---|
#1 | Heat-exchanger without contact | |
#2 | Heat-exchange device details | |
#3 | Casings and printed circuits | |
#4 | Semiconductor devices | |
#5 | Punching metal | |
#6 | Metal-working | |
#7 | Unspecified technologies | |
#8 | Electric digital data processing | |
#9 | Gearing | |
#10 | Forging |
# | Name | Total Patents |
---|---|---|
#1 | Huang Tsung Hsien | 16 |
#2 | Huang Tsung-Hsien | 13 |
Publication | Filing date | Title |
---|---|---|
TW202012868A | Cooling fin stamping and riveting structure | |
TW201938979A | High-efficiency radiator with stamping and radiating fins | |
TW201919791A | Rolling riveting equipment for thin fins and thin cover | |
TW201920897A | Riveting structure of thin heat dissipation fin and thin cover plate | |
TW201907263A | High-efficiency water-cooled radiator | |
TW201838805A | One-stroke stamping transmission mechanism capable of automatically adjusting a stamping spacing to achieve the purpose of the segment adjustment to change the stamping spacing of the stamping material plate, and the function of feeding frame to automatically feed and return the material | |
TW201826077A | Water-cooled drain with impurity filtering function | |
TW201716159A | Hollow pipe punching die | |
TW201713914A | Heat sink assemblyr | |
TW201044630A | The thermal structure of electronic components |