COMPONENT RE-ENGINEERING COMPANY INC has a total of 11 patent applications. Its first patent ever was published in 2012. It filed its patents most often in Republic of Korea, WIPO (World Intellectual Property Organization) and United States. Its main competitors in its focus markets materials and metallurgy, machine tools and semiconductors are COMPONENT RE ENGINEERING COMPANY INC, COMPONENT RE ENG COMPANY INC and MORGAN ADVANCED CERAM INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | Republic of Korea | 3 | |
#2 | WIPO (World Intellectual Property Organization) | 3 | |
#3 | United States | 2 | |
#4 | China | 1 | |
#5 | Japan | 1 | |
#6 | Taiwan | 1 |
# | Industry | |
---|---|---|
#1 | Materials and metallurgy | |
#2 | Machine tools | |
#3 | Semiconductors | |
#4 | Machines | |
#5 | Electrical machinery and energy | |
#6 | Surface technology and coating | |
#7 | Mechanical elements |
# | Name | Total Patents |
---|---|---|
#1 | Elliot Alfred Grant | 6 |
#2 | Balma Frank | 6 |
#3 | Veytser Alexander | 5 |
#4 | Elliot Brent D A | 4 |
#5 | Elliot Brent Donald Alfred | 4 |
#6 | Rex Dennis George | 3 |
#7 | Parker Michael | 3 |
#8 | Schuster Richard Erich | 2 |
#9 | Rex Dennis G | 2 |
#10 | Stephens Jason | 2 |
Publication | Filing date | Title |
---|---|---|
WO2017004242A1 | Temperature sensing device and method for making same | |
US2015108203A1 | Low temperature method for hermetically joining non-diffusing ceramic materials |