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CHIPSIP TECHNOLOGY CO LTD

Overview
  • Total Patents
    38
  • GoodIP Patent Rank
    235,037
About

CHIPSIP TECHNOLOGY CO LTD has a total of 38 patent applications. Its first patent ever was published in 2007. It filed its patents most often in Taiwan. Its main competitors in its focus markets semiconductors are SHANGHAI ETERNAL CHIP SEMICONDUCTOR CO LTD, SHIJIE XIANJIN INTEGRATED CIRC and JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO LTD.

Patent filings in countries

World map showing CHIPSIP TECHNOLOGY CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 38

Patent filings per year

Chart showing CHIPSIP TECHNOLOGY CO LTDs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Chou Ju-Tsung 5
#2 Chen Yi-Cheng 5
#3 Lai Chuncheng 3
#4 Wang Ching-Shan 3
#5 Chen Chinchih 3
#6 Hsu Chun-Yi 3
#7 Chen Chin-Chih 3
#8 Wang Chingshan 3
#9 Lai Chun-Cheng 2
#10 Chen Yicheng 2

Latest patents

Publication Filing date Title
TW201644350A Embedded feet pads and electronic device with embedded feet pads
TW201340262A Stacked semiconductor package structure
TW201316484A Stacked semiconductor package structure
TW201301143A Memory card and card reader
TW201237544A Image projection system
TW201236367A Rf filter system and method thereof
TW201236119A Package structure with carrier
TW201232729A Package structure with conductive path
TW201230269A Package structure and substrate with testing points
TW201227922A Stacked package structure with covers
TW201225236A Package structure with carrier
TW201225411A Package structure with antenna module
TW201216557A Antenna apparatus with shielding case
TW201213835A Electronic device and positioning method thereof
TW201207408A Test apparatus
TW201208508A Electronic apparatus with flexible board
TW201201335A Package structure with lead frame and the lead frame thereof
TW201140074A Testing socket
TW201138309A Semiconductor apparatus with differential pair
TW201135888A Package structure with interposer