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CHIPMORE TECHNOLOGY CORP LTD

Overview
  • Total Patents
    21
  • GoodIP Patent Rank
    191,150
About

CHIPMORE TECHNOLOGY CORP LTD has a total of 21 patent applications. Its first patent ever was published in 2011. It filed its patents most often in China. Its main competitors in its focus markets semiconductors and packaging and shipping are CHANGJIANG ELEC TECH CHUZHOU CO LTD, HUATIAN TECH KUNSHAN ELECTRONICS CO LTD and IPOWER SEMICONDUCTOR.

Patent filings in countries

World map showing CHIPMORE TECHNOLOGY CORP LTDs patent filings in countries
# Country Total Patents
#1 China 21

Patent filings per year

Chart showing CHIPMORE TECHNOLOGY CORP LTDs patent filings per year from 1900 to 2020

Focus industries

Focus technologies

Top inventors

# Name Total Patents
#1 Chen Xiulong 3
#2 Shen Lijuan 2
#3 Mei Yan 2
#4 Cai Wenjuan 2
#5 Xi Yaoxin 2
#6 Sun Bin 2
#7 Wang Dong 1
#8 Song Ling 1
#9 Xu Zhicheng 1
#10 Wang Jiangwei 1

Latest patents

Publication Filing date Title
CN105304544A Vacuum adsorption pen
CN105355574A Preparation method of NiAu projection and NiAu projection assembly
CN104485302A Wafer transfer batching and collecting equipment
CN104465426A Protruding block manufacturing method and protruding block assembly
CN104494878A Packaging device
CN104465623A Flip chip packaging structure
CN103700642A Flip-chip packaging structure
CN103745948A Crystal boat
CN103700679A Protection method of lug generating and manufacture procedure
CN103681443A Ejector pin seat and ejector pin mounting method
CN103871942A High-temperature-resistant rubber suction nozzle
CN103871834A Flip chip packaged wafer combined platform temperature stabilization fixture
CN103869270A Automatic maintenance equipment of probe card and method thereof
CN102749728A Pressing plate correcting jig
CN102744984A Dust removing device for laser stamping of flexible circuit board
CN102744180A Glue injection equipment for glue sealing
CN102738014A Flip chip packaging method
CN102732889A Method and apparatus for removing metal on wafer clamp
CN102736419A Defoaming device for photoresist
CN102738055A Flip chip packaging system and raise clamp thereof