CHEN LIDONG has a total of 11 patent applications. Its first patent ever was published in 2004. It filed its patents most often in United States, China and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, micro-structure and nano-technology and materials and metallurgy are COHEN GUY M, GONG XIONG and BANGSARUNTIP SARUNYA.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 6 | |
#2 | China | 3 | |
#3 | EPO (European Patent Office) | 1 | |
#4 | WIPO (World Intellectual Property Organization) | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Micro-structure and nano-technology | |
#3 | Materials and metallurgy | |
#4 | Telecommunications | |
#5 | Digital networks | |
#6 | Machines |
# | Name | Total Patents |
---|---|---|
#1 | Chen Lidong | 11 |
#2 | He Lin | 6 |
#3 | Backhaus-Ricoult Monika | 5 |
#4 | Li Xiaoya | 4 |
#5 | Zhao Degang | 4 |
#6 | Xia Xugui | 4 |
#7 | Chen Xihong | 2 |
#8 | Huang Xiangyang | 2 |
#9 | Xiong Zhen | 2 |
#10 | Jagadesan Balakumar | 1 |
Publication | Filing date | Title |
---|---|---|
CN109705497A | A kind of no aldehyde stone-plastic plate material | |
CN105004154A | Central control wax boiling and drying equipment and use method thereof | |
CN102887831A | Synthesis process of 3-dodecyloxy-2-guar hydroxypropyl-trimonium chloride (DPAC) | |
US2005241689A1 | Method of improving thermoelectric figure of merit of high efficiency thermoelectric materials | |
US2005238171A1 | Application authentication in wireless communication networks |