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CEMEDINE CO LTD

Overview
  • Total Patents
    637
  • GoodIP Patent Rank
    7,132
  • Filing trend
    ⇩ 33.0%
About

CEMEDINE CO LTD has a total of 637 patent applications. It decreased the IP activity by 33.0%. Its first patent ever was published in 1974. It filed its patents most often in Japan, WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets macromolecular chemistry and polymers, basic materials chemistry and surface technology and coating are BEIJING TONSAN ADHESIVE CO LTD, DONGGUAN DEJU ADHESIVE TECH CO LTD and GUANGZHOU HUITIAN NEW MAT CO LTD.

Patent filings per year

Chart showing CEMEDINE CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Okamura Naomi 212
#2 Saito Atsushi 117
#3 Okabe Yusuke 48
#4 Saito Tomonori 47
#5 Kano Shingo 47
#6 Midorikawa Tomohiro 39
#7 Aoki Hiroshi 36
#8 Yamaga Hiroshi 36
#9 Makino Junzo 28
#10 Futamura Akio 27

Latest patents

Publication Filing date Title
WO2020170616A1 Primer composition
WO2020129955A1 Moisture-curable hot-melt adhesive
WO2020121672A1 Primer composition
JP2020200646A Installation method of in-opening mounting body
WO2019235332A1 Adhesion method and adhesive agent
CN111989379A Building with wall structure and method for manufacturing wall structure
JP2020147698A Photo-curable adhesive composition
JP2019155918A Method of bonding rubber member
WO2019146565A1 Formation method, and flame-resistant, single-component, ambient-temperature-and-humidity-curable reactive hot melt composition
WO2019131311A1 Wiring board, wiring board manufacturing method, and conductive curable composition
KR20200107994A Mounting body
WO2019073980A1 Photocurable adhesive composition, and bonding method
WO2019073978A1 Bonding method, and photocurable adhesive composition
WO2019073979A1 Photocurable adhesive composition, and bonding method
JP2020037643A Method for manufacturing structure
KR20200050454A Refractory curable composition
JP2019044578A Adhesive type panel wall structure and adhesive type panel material installation method
JP2020007745A Repair method of floating part of wall or the like and reinforcing pin fixing method
JP2019183090A Two-liquid type curable resin composition
JP2019192768A Substrate and three-dimensional circuit