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SHANGHAI BONOTEC ELECTRONIC MAT CO LTD

Overview
  • Total Patents
    15
  • GoodIP Patent Rank
    109,622
  • Filing trend
    ⇧ 400.0%
About

SHANGHAI BONOTEC ELECTRONIC MAT CO LTD has a total of 15 patent applications. It increased the IP activity by 400.0%. Its first patent ever was published in 2017. It filed its patents most often in China. Its main competitors in its focus markets basic materials chemistry, macromolecular chemistry and polymers and electrical machinery and energy are TIANCHANG YONGTAI SEALING MAT CO LTD, SHANDONG KY NEW MATERIAL TECH CO LTD and FOSHAN NANPAO ADVANCED MAT CO LTD.

Patent filings in countries

World map showing SHANGHAI BONOTEC ELECTRONIC MAT CO LTDs patent filings in countries
# Country Total Patents
#1 China 15

Patent filings per year

Chart showing SHANGHAI BONOTEC ELECTRONIC MAT CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 He Yong 5
#2 Li Pan 4
#3 Yu Wei 2
#4 Xu Yazhen 2
#5 Xiao Jianwei 1
#6 Guo Chenting 1
#7 Du Wei 1
#8 Jiang Luyao 1
#9 Yang Yingzhou 1
#10 Chen Jimeng 1

Latest patents

Publication Filing date Title
CN112143428A Low-temperature curing low-contact-resistance single-component adhesive
CN111944472A Photo-curing adhesive and preparation method and application thereof
CN111925767A Visible light curing adhesive composition and application thereof
CN110396386A A kind of chip sealing insulative glue and preparation method thereof with high thermal conductivity coefficient
CN110272703A A kind of highly conductive Single Component Eopxy Adhesives of low-temperature setting and preparation method thereof
CN110184011A A kind of low-temperature fast-curing epoxy glue
CN110232986A A kind of flexible electronic paper conductive silver paste and preparation method thereof
CN110184024A Black light curable adhesive composition and its preparation method and application
CN110204726A A kind of preparation method of organosilicon modified crylic acid resin
CN110484177A A kind of dual cure epoxy adhesive and preparation method thereof
CN110467898A A kind of PUR adhesive and preparation method thereof
CN110467901A OLED heats dual UV curable paint organic silicon modified epoxy acrylate glue and preparation method with UV
CN110437747A A kind of nothing collapses double solidification glues of UV- moisture and preparation method thereof
CN110437761A A kind of low-temperature curable single-component epoxy electroconductive binder and preparation method thereof
CN109880561A A kind of epoxy resin embedding adhesive composition and preparation method thereof